Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Rethinking the interplay between affluence and vulnerability to aid climate change adaptive capacity
Eriksen, Christine; Simon, Gregory L.; Roth, Florian; Lakhina, Shefali Juneja; Wisner, Ben; Adler, Carolina; Thomalla, Frank; Scolobig, Anna; Brady, Kate; Bründl, Michael; Neisser, Florian; Grenfell, Maree; Maduz, Linda; Prior, Timothy
Journal Article
2007Technologies for functional hetero-system integration on foil
Bock, K.; Adler, C.; Bollmann, D.; Klink, G.; Feil, M.; Strohhöfer, C.
Conference Paper
2004The challenge of ultra thin chip assembly
Feil, M.; Adler, C.; Hemmetzberger, D.; König, M.; Bock, K.
Conference Paper
2003Ultra thin ICs and MEMS elements. Techniques for wafer thinning, stress-free separation, assembly and interconnection
Feil, M.; Adler, C.; Klink, G.; König, M.; Landesberger, C.; Scherbaum, S.; Schwinn, G.; Spöhrle, H.
Journal Article
2001Interconnection Techniques for Ultra Thin ICs and MEMS Elements
Feil, M.; Adler, C.; Klink, G.; König, M.
Conference Paper
2000Assembly of Ultra Thin and Flexible ICs
Adler, C.; Klink, G.; Feil, M.; Ansorge, F.; Reichl, H.
Conference Paper
2000Aufbau- und Verbindungstechnik für extrem dünne Chips
Klink, G.; Adler, C.; Hemmetzberger, D.; Feil, M.
Conference Paper